CPU cooler manufacturer, Cooleserver, has listed the first cooling products for AMD's SP6 EPYC Siena chips.
AMD SP6 Cooler Product Page Reveals Same Mounting Mechanism For EPYC Siena CPUs
Coolserver has listed its first official AMD SP6 cooler, the SP6 M97, which features a single tower-type heatsink with two 120mm fans. The cooler has been specifically tuned around the AMD SP6 socket which will be featuring support for AMD's EPYC Siena line of CPUs.
In terms of design, the Coolserver AMD SP6 4U-M97 features the same size & dimensions as its SP3 sibling, measuring 125mm * 98mm * 155mm and featuring two PWM fans with peak RPMs of 2200 and 86 CFM of maximum airflow. The CPU cooler is designed to cool up to 400W of TDP and that's easily gonna cover the entire CPU stack. The heatsink itself features a copper base plate and comes with five heat pipes integrated within the aluminum fin block. The cooler also comes with TIM pre-applied.
The AMD SP6 platform and EPYC Siena lineup will be a more TCO-optimized offering for low-end servers. It will be a 1P solution, offering 6-channel memory, 96 PCIe Gen 5.0 lanes, 48 lanes for CXL V1.1+, and 8 PCIe Gen 3.0 lanes. The platform will feature Zen 4 EPYC CPUs but only the entry-level solutions with up to 32 Zen 4 and up to 64 Zen 4C cores under the EPYC Siena family.
Their TDPs will range between 70-225W. So it looks like the SP6 platform is designed to support the entry-level variants of EPYC Genoa, Bergamo, and even the Zen 5-based Turin CPUs. It will focus on Density & Perf/Watt optimizations for Edge / Telecommunication segment leadership. Documents discovered by @Olrak (via Anandtech Forums), it looks like the SP6 socket is vastly similar to the existing SP3 socket so the packaging layout of the SP6 chips will be similar compared to existing EPYC CPUs too.
They won't use the full 12-die layout as the AMD EPYC Genoa or Bergamo do but rather stick to an 8-die layout as the existing parts. While the socket looks the same, the internal pin layout has been modified to LGA 4844 vs LGA 4096 (on SP3 sockets). Other measurements are the same at 58.5 x 75.4.
It remains to be seen if a version of SP6 comes to the AMD Threadripper lineup. For now, we know that the next-gen Threadripper 7000 "Storm Peak" family will come in HEDT & Workstation flavors with HEDT offering 4-channel memory support and WS offering 8-channel memory support. AMD is likely to use the SP5/TR5 socket for its WS chips which will feature the LGA 6096 socket that is also used for Genoa / Bergamo chips but the HEDT platform may utilize the SP6/TR6 socket. The next-gen Threadripper chips are expected to launch in Q3 2023.
Refference- https://wccftech.com
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