G.Skill has announced the launch of their new 32 GB DDR4 modules which will be put together in 256 GB memory kits available later this year. The new memory kits are aimed at Intel's 10th Gen X-Series processors which make a debut next month.
32 GB DIMMs From G.Skill Are Finally Here With The Royal RGB Line (Press Release)
G.SKILL, a world-leading manufacturer of extreme performance memory and gaming peripherals, is announcing new high-capacity, high-performance memory kit specifications based on 32GB modules across several series, including Trident Z Royal DDR4-3200 CL16 256GB (32GBx8), Trident Z Royal DDR4-4000 CL18 128GB (32GBx4), Trident Z Neo DDR4-3600 CL18 128GB (32GBx4), and Trident Z Neo DDR4-3800 C18 64GB (32GBx2). Built with the latest high-density 16Gb components, these DDR4 memory kits are the perfect choice for pushing the performance limits of high memory capacity.
With the availability of higher density memory at the consumer level, G.SKILL memory is pushing the performance boundary to DDR4-3200 on current HEDT platforms with up to 8 modules of 32GB for a total of 256GB. As shown in the screenshot below, the Trident Z Royal DDR4-3200 CL16 256GB (32GBx8) is validated on the latest X299-based ASUS ROG Rampage VI Extreme Encore motherboard and the Intel
Core i9-9820X processor. Such extremely high-capacity memory kits are the ideal choice for powerful workstations or for systems running multiple virtual machines.
High capacity 32GB modules are no slouch when it comes to high frequency, breaking through DDR4-4000 CL18 with 128GB (32GBx4), as shown with the ASUS ROG Rampage VI Extreme Encore motherboard and Intel Core i9-9820X processor.
Up To 128 GB Of Memory On A Dual Channel System
Even without a HEDT system, it's now possible to reach a total of 128GB on current 4-DIMM motherboards. Under the AMD-optimized Trident Z Neo series, the following screenshot below shows the Trident Z Neo DDR4-3600 CL18 128GB (32GBx4) being stress-tested on the MSI MEG X570 GODLIKE motherboard and the AMD Ryzen 5 3600 processor.
At the extreme limits of AMD Ryzen 3000 platform, G.SKILL is also releasing a blazing dual-module behemoth kit of 64GB (32GBx2) at DDR4-3800 CL18 under the Trident Z Neo series, validated on the MSI MEG X570 GODLIKE motherboard and AMD Ryzen 9 3900X processor, as shown below. These ultra-high capacity performance memory specifications will support the latest Intel XMP 2.0 for easy overclocking.
They will be available via G.SKILL worldwide distribution partners in Q4 2019. For a list of memory specifications based on the new 32GB modules, please refer to the table above.
The post G.Skill Upgrades DDR4 Modules To 32 GB, Up To 256 GB Memory Kits Available By End of Year – Aimed at Intel’s 10th Gen X-Series by Alex Casas appeared first on Wccftech.
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