AMD is preparing their new desktop aimed, Ryzen 3000 APUs, which will be coming out soon. Last week, we got to see the first picture of one such processor posted by a leaker at Chiphell. Now the same leaker has made an unsuccessful attempt of delidding the processor, completely destroying it but also exposing what lies under the IHS.
AMD Ryzen 5 3400G and Ryzen 3 3200G Desktop APU Specifications Leaked – 12nm Zen+ Picasso Lineup For AM4, Great CPU Overclocking Potential
In the last post, we made it clear that the Ryzen 3000 CPUs and Ryzen 3000 APUs are two different things. The Ryzen 3000 CPUs will be based on the new 7nm Zen 2 architecture while the APUs will be based on the existing 12nm Zen+ architecture. The reason why AMD is launching their APUs on existing process rather than the new 7nm node is that desktops never really got a taste of Zen+ 12 nm based APUs so AMD is preparing a launch now. There would obviously be the 7nm Ryzen 4000 family but that would launch later on.
So coming to the specifications first, the same leaker (whose post has been taken down now) did mention some details. According to the leaker, the Ryzen 3 3200G can be overclocked to 4.3 GHz with 1.38V which is impressive considering its predecessor, the Ryzen 3 2200G, which could only manage 4.0 GHz with the same voltage. The Ryzen 5 3400G, on the other hand, can push clocks of up to 4.25 GHz with a voltage bump of 1.38V while the Ryzen 5 2400G could only manage 3.925 GHz with the same voltage. The overclock was applied across all cores.
The temperatures on each processor were also reported with the Ryzen 3 3200G maxing out at 75C with the said overclock figures which is the same as the Ryzen 3 2200G which operated at 300 MHz slower clock speed. The Ryzen 5 3400G manage 80C at max load which was just 1 degrees bump over the overclocked Ryzen 5 2400G while offering a 325 MHz bump in clock speed. This shows that the new Zen+ architecture delivers a 300 MHz+ overclock potential on the upcoming Ryzen 3000 series APUs. All processors rock 4 MB of L3 cache with the Ryzen 3 series rocking 4 core and 4 thread design while the Ryzen 5 series rock 4 cores and 8 threads.
Now moving on to the most interesting part, after all the overclocking was done, the leaker tried to delid the Ryzen 3 3200G APU. After an unsuccessful attempt which completely destroyed the die, the die area underneath was exposed. The chip looks to be of the same size and dimensions as the previous Ryzen 2000 series APUs although we can’t say for sure. The one major upgrade is that the Ryzen 3000 APUs feature a gold-plated, solder design compared to the tradition TIM application in the previous series. This could explain the much better thermals with higher overclocks on the new APUs.
While the specs may not seem like much of a change, it should be known that the AMD Picasso generation of APUs was always meant to feature the Raven Ridge design while adopting the Zen+ cores for power/performance uplift. The Ryzen 3000 APUs have already been announced for the notebook platforms and now we are going to see them in action on the desktop AM4 platform too.
The post AMD Ryzen 5 3400G and Ryzen 3 3200G APU Specifications Detailed – 12nm Zen+ Based 3200G Delidded and Destroyed By Leaker, Features Soldered IHS by Hassan Mujtaba appeared first on Wccftech.
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