Intel Teases Xe GPUs in BFP “Big Fabulous Package” Flavors, Three Massive Chips Based on Xe HP & Xe HPC Graphics Architectures

Intel has just teased its upcoming Xe architecture powered GPUs which come in three distinct packages. The three Xe GPUs were teased by Raja Koduri who gave a visit to the Xe GPU Lab in Folsom, California.

Intel Teases Three Massive Xe GPUs In BFP "Big Fabulous Package" Flavors - Coming To A Data Center Near You Soon!

From Xe LP to Xe HPC, Intel is developing all sorts of GPUs which will go on to power its next-gen graphics portfolio. At the helm of these products would be the Xe HP and Xe HPC powered GPUs which will be featured in machines with up to exaflops of compute power. Intel already gave us a glimpse of one of their Xe HP GPU a while back when Raja Koduri posted about a celebration back in December 2019 which marked a significant milestone in the development of the largest silicon in Bangalore, India.

But even that massive chip with a package size exceeding 3500mm2 is nothing compared to what Raja has teased us today. For starters, there are three distinct GPU packages that Raja has teased including the Xe HP package we got to see earlier accompanied by a smaller die & a super-massive one which eclipses the other two chips.

Based on our exclusive report and from what Intel has talked about in regards to its Ponte Vecchio chip, it looks like Intel in all onboard the MCM train with each chip consisting of several Xe GPU tiles that will be interconnected together to form a monster of a GPU. Here are the actual EU counts of Intel's various MCM-based Xe HP GPUs along with estimated core counts and TFLOPs:

  • Intel Xe HP (12.5) 1-Tile GPU: 512 EU [Est: 4096 Cores, 12.2 TFLOPs assuming 1.5GHz, 150W]
  • Intel Xe HP (12.5) 2-Tile GPU: 1024 EUs [Est: 8192 Cores, 20.48 assuming 1.25 GHz, TFLOPs, 300W]
  • Intel Xe HP (12.5) 4-Tile GPU: 2048 EUs [Est: 16,384 Cores, 36 TFLOPs assuming 1.1 GHz, 400W/500W]

Once again, Raja has stationed a single AA battery for scale and we will definitely provide a more in-depth article on the specific package sizes of the other two chips in a follow-up article. Raja Koduri also makes use of a new and interesting terminology to define the massive size of its Xe HP and Xe HPC parts referred to as BFP or Big Fabulous Package.

The post Intel Teases Xe GPUs in BFP “Big Fabulous Package” Flavors, Three Massive Chips Based on Xe HP & Xe HPC Graphics Architectures by Hassan Mujtaba appeared first on Wccftech.



Refference- https://wccftech.com

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