We’re only weeks away from the launch of the AMD Ryzen 3000 Series, Radeon RX 5700 Series, and X570 motherboards but Phillipino site NguyenCongPC.vn apparently couldn’t wait to get their preliminary reviews up for the ASUS Pro WX X570-ACE and the ASUS TUF X570-Plus Wifi. While they did not have any performance figures we do get a bit of an insight into what the vendors are bringing to the table in terms of packaging, a better look at the boards themselves, and a peek under the VRM heatsinks to see just what they’ve done this time around in terms of power delivery.
Thanks to the evaluation we can see the entire hierarchy of how ASUS is positioning their boards with a very strange pyramid showing that their TUF lineup is aimed at entry gamers and first-time builders and will be the baseline gaming series. The WS board is going to land just over the Prime lineup which is intended for the general audience.
ASUS TUF X570-Plus Wifi
Since ASUS has changed the TUF series a while back and got for the black and yellow theme I haven’t been the biggest fan, but this design has been the least offensive so far to me. The ASUS TUF X570-Plus (Wifi) is an entry-level gaming class board from ASUS. One major thing of note if you follow their full review you find that the board is not designed with multiple graphics cards in mind as the secondary PCIe x16 slot is only wired for x4 electrically. The VRMs on the board were noted as designed for a 12+2 circuitry but are actually being controlled by the ASP1106GGQW in a 4+2 configuration with 4 real phases, you’ll find this controller on many B class motherboards.
ASUS Pro WS X570-ACE
The Pro WS X570-ACE has had my attention since the first time it showed up in a list a while back. The final product is a very clean and professional design with no gamer aesthetics to be found. While this one is loaded with 3 PCIe x16 slots the first one is wired for full x16 and the two descending slots are wired for x8. The VRM heatsink is rather nice on this one with a full fin array, although traditional heatsink fins would have been wicked here over the machined fins it is still a nice compromise. The power delivery under those heatsinks is nicely spaced for heat distribution and sporting a 12+2 phase setup using the PWM ASP1405I controller that is actually located on the back of the PCB. While this board isn’t exactly on the overclockers list this should prove to be able to hold high sustained clocks on the most demanding of the Ryzen 3000 series chips.
They have no performance numbers which I assume is a measure taken to try to get these limited information reviews out while skirting the embargoes placed on them. Or, it’s possible they had no embargo at all and didn’t have any Ryzen 3000 Series chips to run in them. Either way, it’s nice to get a good look at the boards and see what we can expect from ASUS come July 7, 2019.
AMD Ryzen 3000 Series CPU Lineup
| CPU Name | Ryzen 5 3600 | Ryzen 5 3600X | Ryzen 7 3700X | Ryzen 7 3800X | Ryzen 9 3900X | Ryzen 9 3950X |
|---|---|---|---|---|---|---|
| Cores/Threads | 6/12 | 6/12 | 8/16 | 8/16 | 12/24 | 16/32 |
| Base Clock | 3.6 GHz | 3.8 GHz | 3.6 GHz | 3.9 GHz | 3.8 GHz | 3.5 GHz |
| Boost Clock | 4.2 GHz | 4.4 GHz | 4.4 GHz | 4.5 GHz | 4.6 GHz | 4.7 GHz |
| Cache (L2+L3) | 35 MB | 35 MB | 36 MB | 36 MB | 70 MB | 72 MB |
| PCIe Lanes (Gen 4 CPU+PCH) | 40 | 40 | 40 | 40 | 40 | 40 |
| TDP | 65W | 95W | 65W | 105W | 105W | 105W |
| Price | $199 US | $249 US | $329 US | $399 US | $499 US | $749 US |
AMD’s Next-Gen X570 Chipset – First Mainstream Platform To Support PCIe Gen 4, Feature Rich and Ready For Ryzen 3000 CPUs
As we saw with X470, there were a few features of the Ryzen 2000 series processors which were only supported by new motherboards such as Precision Boost Overdrive and XFR 2.0. There’s no doubt that AMD’s Zen 2 based Ryzen mainstream processor family has some amazing new features, but the main highlight would be support for PCIe Gen4. The X570 platform will be an all PCIe Gen4 solution, which means this would most probably be the first consumer platform to feature support for the new PCIe standard.
In terms of IO details, the CPU will once again be offering a total of 24 PCIe Gen 4 lanes while the PCH will be providing a total of 16 PCIe Gen 4 lanes. There will be one direct link heading out to the first PCI Express x16 and PCI Express x4 slot from the CPU, while the rest of the IO would be handled by the X570 PCH which would be linked to the CPU through an x4 link.
We have already rounded up all the X570 motherboards that were announced during Computex 2019 including the flagship X570 boards for all major manufacturers.
That, however, doesn’t mean that AMD Ryzen 3000 series would only be compatible on X570 boards since just like last time, the new CPUs will be backward compatible with X470 & X370 boards too. Following are links to the respective motherboard manufacturers BIOS release for existing motherboards to support 3rd Gen AMD Ryzen CPUs:
- ASRock AM4 (3rd Gen Ryzen) BIOS Support Link
- Gigabyte AM4 (3rd Gen Ryzen) BIOS Support Link
- ASUS AM4 (3rd Gen Ryzen) BIOS Support Link
- MSI AM4 (3rd Gen Ryzen) BIOS Support Link
- BIOSTAR AM4 (3rd Gen Ryzen) BIOS Support Link
They certainly won’t display the same featureset that will be available on the newly launched X570 lineup but will feature fully stable functionality for users who just want to drop in a new CPU and continue using their PCs without the hassle of upgrading the motherboard and everything from scratch. AMD’s X570 platform and Ryzen 3000 CPUs are planned for launch on 7th July while the AMD Ryzen 9 3950X will be available in September 2019.
The post ASUS TUF X570 Plus And Pro WS X570-ACE Reviews Posted Ahead Of Launch by Keith May appeared first on Wccftech.
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